MIXDES - The MIXDES 2013 information

20th International Conference Mixed Design of Integrated Circuits and Systems
June 20-22, 2013, Gdynia, Poland

The MIXDES 2013 Conference took place in Gdynia. The topics of the MIXDES Conference included:

  1. Design of Integrated Circuits and Microsystems
  2. Thermal Issues in Microelectronics
  3. Analysis and Modelling of ICs and Microsystems
  4. Microelectronics Technology and Packaging
  5. Testing and Reliability
  6. Power Electronics
  7. Signal Processing
  8. Embedded Systems
  9. Medical Applications
  10. Student Projects

The total number of 115 papers from 21 countries were accepted for publication including 6 invited papers.

The following invited papers were presented during the conference:

  1. Design and Simulation of ESD-Resistant ICs
    V. Axelrad (SEQUOIA Design Systems, Inc., USA)
  2. BSIM Compact MOSFET Models for SPICE Simulation
    Y.S. Chauhan (Indian Inst. of Techn. Kanpur, INDIA), S. Venugopalan, C.C. Hu, N. Paydavosi (Univ. of California Berkeley, USA), P. Kushwaha (Indian Inst. of Techn. Kanpur, INDIA), S. Jandhyala, J.P. Duarte (Univ. of California Berkeley, USA), S. Agnihotri, C. Yadav, H. Agarwal (Indian Inst. of Techn. Kanpur, INDIA), A. Niknejad (Univ. of California Berkeley, USA)
  3. Top-down Drift-diffusion versus Bottom-up Quasi-ballistic Formalism in Device Compact Modeling
    X. Zhou, J. Zhang, B. Syamal, Z. Zhu, H. Zhou, S.B. Chiah (Nanyang Techn. Univ., SINGAPORE)
  4. The Art of Modeling and Predictive Simulation in Power Electronics and Microsystems
    G. Wachutka (Munich Univ. of Techn., GERMANY)
  5. On the Use of Compact Modeling for RF/Analog Design Automation
    M.H. Fino, F. Coito (Univ. Nova de Lisboa, PORTUGAL)
  6. A Mixed-Design Technique for Integrated MEMS Using a Circuit Simulator with HDL
    H. Toshiyoshi (Univ. of Tokyo, JAPAN), T. Konishi, K. Machida (NTT Adv. Techn. Corp., JAPAN), K. Masu (Tokyo Instit. of Techn., JAPAN)

The following special sessions were organised during the conference:

  1. Compact Modeling for More than Moore
    • Characteristic Parameters Evaluation of Hall Cells with High Performance
      M.-A. Paun, J.-M. Sallese, M. Kayal (EPFL, SWITZERLAND)
    • A Simple Method for Extraction of Threshold Voltage of FD SOI MOSFETs
      G. Gluszko, D. Tomaszewski, J. Malesińska, K. Kucharski (Institute of Electron Techn., POLAND)
    • Two-dimensional Physics-based Modeling of Electrostatics and Band-to-Band Tunneling in Tunnel-FETs
      M. Graef, T. Holtij, F. Hain, A. Kloes (Tech. Hochschule Mittelhessen, GERMANY), B. Iniguez (Univ. Rovira i Virgili, SPAIN)
    • A Compact Model of VES-BJT Device
      W. Kuźmicz, P. Mierzwiński (Warsaw Univ. of Techn., POLAND)
    • Modeling of a THz Radiation Detector Built of Planar Antenna Integrated with MOSFET
      P. Kopyt (Warsaw Univ. of Techn., POLAND)
    • Unified Charge Model for Short-Channel Junctionless Double Gate MOSFETs
      T. Holtij, M. Graef, F. Hain, A. Kloes (Tech. Hochschule Mittelhessen, GERMANY), B. Iniguez (Univ. Rovira i Virgili, SPAIN)
    • A Swept Parameter Technique for Statistical Circuit Simulation
      M. Brinson (London Metropolitan Univ., UK)
    • Low-Power RF Modeling of a 40nm CMOS Technology Using BSIM6
      M.-A. Chalkiadaki, C.C. Enz (EPFL, SWITZERLAND)
    • A Compact Model of AlGaN/GaN HEMTs Power Transistors Based on a Surface-Potential Approach
      P. Martin, L. Lucci (CEA-LETI, FRANCE)
  2. xTCA for Instrumentation
    • Management Funtionality Extension for RTM and eRTM in MTCA.4 Crates
      T. Jeżyński, F. Ludwig, U. Mavrič (DESY, GERMANY), K. Czuba, T. Leśniak (Warsaw Univ. of Techn., POLAND)
    • MTCA.4 LLRF System for the European XFEL
      J. Branlard, G. Ayvazyan, V. Ayvazyan, M. Grecki, M. Hoffmann, T. Jeżyński, F. Ludwig, U. Mavrič, S. Pfeiffer, H. Schlarb, C. Schmidt, H. Weddig, B. Yang (DESY, GERMANY), P. Barmuta, S. Bou Habib, Ł. Butkowski, K. Czuba, M. Grzegrzółka, E. Janas, J. Piekarski, I. Rutkowski, D. Sikora, Ł. Zembala, M. Żukociński (Warsaw Univ. of Techn., POLAND), W. Cichalewski, W. Jałmużna, D. Makowski, A. Mielczarek, A. Napieralski, P. Perek, A. Piotrowski, T. Poźniak, K. Przygoda (Lodz Univ. of Techn., POLAND), G. Bołtruczyk, S. Korolczuk, M. Kudła, J. Szewiński (National Centre for Nuclear Research, POLAND), K. Oliwa, W. Wierba (Polish Academy of Sciences, POLAND)
    • Diagnostic Use Case Examples for ITER Plant Instrumentation and Control
      S. Simrock (ITER, FRANCE)
    • Software Development for uTCA-based LLRF Control System
      A. Piotrowski (Lodz Univ. of Techn., POLAND)
    • Industrialization and Application of the New Crate Standard MTCA.4
      H. Schlarb (DESY, GERMANY)
    • Design and Preliminary Evaluation of Integrated Radiation Spectrometer for Longitudinal e-Bunch Diagnostics at FELs
      G. Jabłoński, Ł. Kotynia, D. Makowski, A. Mielczarek, P. Perek, A. Napieralski (Lodz Univ. of Techn., POLAND), B. Steffen (DESY, GERMANY)
    • AMC Frame Grabber Module with PCIe Interface
      A. Mielczarek, P. Perek, D. Makowski, M. Orlikowski, G. Jabłoński, A. Napieralski (Lodz Univ. of Techn., POLAND)
    • Femtosecond Precision via RF Backplane in MTCA Crates
      K. Czuba, A. Łysiuk (Warsaw Univ. of Techn., POLAND), P. Barmuta (Warsaw Univ. of Techn., POLAND and Katholieke Univ. Leuven, BELGIUM), T. Jeżyński (DESY, GERMANY), T. Leśniak (Warsaw Univ. of Techn., POLAND), F. Ludwig, H. Schlarb (DESY, GERMANY)
    • MTCA.4 Compliant Piezo Driver RTM for Laser Synchronization
      K. Przygoda (Lodz Univ. of Techn., POLAND), M. Felber, H. Schlarb (DESY, GERMANY)
    • Software Components of MTCA-based Image Acquisition System
      P. Perek, M. Orlikowski, G. Jabłoński, A. Mielczarek, D. Makowski (Lodz Univ. of Techn., POLAND)
    • MTCA Fast Digitizer for Direct RF Measurements
      S. Bou Habib (Warsaw Univ. of Techn., POLAND)

The following papers has been awarded:

Distributed Electrothermal Modeling Methodology for MOS Gated Power Devices Simulations
E. Marcault, J.-L. Massol, P. Tounsi, J.-M. Dorkel (LAAS-CNRS, FRANCE)

  1. Outstanding Paper Award:
    • A Continuous-Time Instrumentation Amplifier Employing a Novel Auto-Zeroing Structure
      S. Marechal (EPFL, SWITZERLAND), O. Nys (Semtech Neuchâtel Sŕrl, SWITZERLAND), F. Krummenacher (EPFL, SWITZERLAND), M. Chevroulet (Semtech Neuchâtel Sŕrl, SWITZERLAND), M. Kayal (EPFL, SWITZERLAND)
    • A Method of Initial Search Region Reduction for Acoustic Localization in Distributed Systems
      S. Astapov, J. Berdnikova, J.-S. Preden (Tallinn Univ. of Techn., ESTONIA)
    • Analytical Characterization of Variable Width Integrated Spiral Inductors
      F. Passos, M.H. Fino (Univ. Nova de Lisboa, PORTUGAL), E. Roca Moreno (CSIC-IMSE, SPAIN)
    • Automated Design of Switched Current Sigma-Delta Modulator with a New Comparator Structure
      P. Śniatała, A. Handkiewicz, M. Naumowicz, S. Szczęsny, M. Melosik, P. Katarzyński, M. Kropidłowski (Poznan Univ. of Techn., POLAND)
    • Architecture and Simulation Results of a High-Speed Multichannel Integrated Circuit for Optical Radiation Sensors
      Ł. Kotynia, A. Napieralski (Lodz Univ. of Techn., POLAND)
    • Development of Ionizing Radiation Detectors Integrated with Readout Electronics
      D. Obrębski, A. Szymański, D. Tomaszewski, M. Grodner, J. Marczewski (Institute of Electron Techn., POLAND), J. Pieczyński (Fraunhofer Institute IMS, GERMANY
    • Heavily Doped Junctionless Vertical Slit FETs with Slit Width below 20 nm
      L. Barbut, F. Jazaeri, D. Bouvet, J.-M. Sallese (EPFL, SWITZERLAND)
    • Reliability Study on Technology Trends Beyond 20nm
      E. Amat, A. Calomarde, A. Rubio (Univ. Politècnica de Catalunya, SPAIN)
    • Report on Efficiency of Field-Installed PV-Inverter with Focus on Radiation Variability
      M. Piotrowicz, W. Marańda (Lodz Univ. of Techn., POLAND)
    • Universal Design Method of n-to-2n Decoders
      I. Brzozowski, Ł. Zachara, A. Kos (AGH Univ. of Science and Techn., POLAND)
  2. Poland Section IEEE ED Chapter Special Award
    • Closed-Loop Oscillator Circuit for Piezoresistive Carbon Nanotube NEMS Resonators
      C. Kauth, M. Pastre, M. Kayal (EPFL, SWITZERLAND)

Receipt of papers:

March 1st, 2017

Notification of acceptance:

April 30th, 2017

Registration opening:

May 15th, 2017

Final paper versions:

May 31th, 2017