1. Design of Integrated Circuits and Microsystems: Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.
  2. Thermal Issues in Microelectronics: Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.
  3. Analysis and Modelling of ICs and Microsystems: Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.
  4. Microelectronics Technology and Packaging: New microelectronic technologies. Packaging. Sensors and actuators.
  5. Testing and Reliability: Design for testability and manufacturability. Measurement instruments and techniques.
  6. Power Electronics: Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.
  7. Signal Processing: Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.
  8. Embedded Systems: Design, verification and applications.
  9. Medical Applications: Medical and biotechnology applications. Thermography in medicine.

Receipt of papers:

February 28th, 2018

Notification of acceptance:

April 30th, 2018

Registration opening:

May 15th, 2018

Final paper versions:

May 15th, 2018