MIXDES - The MIXDES 2001 information

8th International Conference
Mixed Design of Integrated Circuits and Systems
Zakopane, 21-23 June 2001

The MIXDES 2001 Conference took place in Zakopane, Poland. The topics of the MIXDES Conference included:

  1. Design of Integrated Circuits and Microsystems
  2. Thermal Issues in Microelectronics
  3. Analysis and Modelling of ICs and Microsystems
  4. Microelectronics Technology and Packaging
  5. Testing and Reliability
  6. Power Electronics
  7. Signal Processing
  8. Interdisciplinary Applications
  9. Education

The total number of 101 papers from 21 countries were accepted for publication including 3 invited papers.

The following invited papers were presented during the conference:

  1. MEMS and Silicon Micromachined Components for Communications Systems, K. Grenier, L. Rabbia, A. Takacs, P. Pons, T. Parra, H. Aubert, J. Graffeuil, P. Combes, P. Caudrier, R. Plana (LAAS-CNRS, ENSEEIHT and Univ. Paul Sabatier, FRANCE)
  2. Microfabricated Tools for Nanometer-scale Applications, C. Bergaud, L. Nicu (LAAS-CNRS, FRANCE), B. Belier (Institut d'Electronique Fondamentale, FRANCE)
  3. Nyquist Noise in Resistors for Non-uniform Temperature Distribution, G. De Mey (Univ. Gent, BELGIUM)

The following special sessions were organised during the conference:

  1. Special Session
    • Advancements in DC and RF MOSFET Modeling with the EPFL-EKV Charge Based Model, J.-M. Sallese (Swiss Federal Inst. of Techn., SWITZERLAND), W. Grabinski (MOTOROLA Geneva, SWITZERLAND), A.S. Porret (Swiss Federal Inst. of Techn., SWITZERLAND), M. Bucher (NTUA, GREECE), C. Lallement (ENSPS, FRANCE), F. Krummenacher, C. Enz, P. Fazan (Swiss Federal Inst. of Techn., SWITZERLAND)
    • Compact Modeling of Low-power and RF Analogue MOSFET Devices, W. Grabinski (MOTOROLA Geneva, SWITZERLAND)
    • Modeling of Gate Tunnel Currents in MOS and MOS/SOI Transistors, B. Majkusiak (Warsaw Univ. of Techn., POLAND)
    • MOS Model Parameter Extraction Based on 2D Numerical Simulation, W. Kuzmicz (Institute of Electron Techn., POLAND)
    • Professional Software Tools for Device Modeling, F. Sischka (Agilent Technologies, GERMANY)
    • The Real Barrier to Standardized Compact Models, C.C. McAndrew (MOTOROLA Tempe, USA)
    • Thorough Verification of Large-signal RF MOSFET Models by Means of Vectorial Large-signal Measurements, D. Schreurs, S. Vandenberghe (Katholieke Univ. Leuven, BELGIUM), E. Vandamme (Agilent Technologies, BELGIUM)

Receipt of papers:

February 28th, 2018

Notification of acceptance:

April 30th, 2018

Registration opening:

May 15th, 2018

Final paper versions:

May 15th, 2018